GENESIS ULTRA LOW BAKE POWDER COATING (ULB)

Availability: Out of stock



Description

  • GENESIS UBL is an Ultra-Low Bake Powder Coating system developed for use on MDF and other heath sensitive substrates. Advancements in the powder coating technology have enabled to coat on heat sensitive substrates at much lower temperature. The powder coating process has the advantages of being a one-step finishing system, not requiring successive coats or a longer time to dry. ULB powders are reclaimable, safe and environmental friendly compare to other alternatives such as liquid paints and varnishes.
  • Key Features Of Genesis ULB Powder Coating:
  • Suitable for Interior usage only.
  • Available in a wide range of RAL and other custom-made colours
  • Available in soft sandtex pattern, fine texture, and hammer tone antiques.
  • Environmentally friendly coating comparing with conventional liquid paints & varnishes.
  • One coat application process like conventional powder coating systems.
  • Excellent application properties, controlled particle size distribution, higher transfer efficiency, charging, and edge coverage.
  • Lesser surface preparations required prior to powder coating comparing with normal paints & varnishes
  • Significant savings in energy, time and space.
  • Low temperature cure permits wide range of heat sensitive substrates to be powder coated
  • Powder Characteristic:
  • Patterns Soft Sand Texture, fine texture, hammer tone antiques
  • Colours RAL & other custom-made shades as per requirement
  • Specific gravity 1.20 – 1.70
  • Particle size Suitable for electrostatic spraying
  • Storage Dry ventilation conditions below 30˚C
  • Shelf life 6months
  • Substrate:
  • Substrate 18mm Medium Density Fibreboard
  • Density >750gm/cm3
  • Moisture 8-10%
  • Preparation
  • Main side requires lesser surface preparation.
  • Edges should be sanded or treated to minimize the out gassing and pin holing.
  • Grit paper is recommended to get the typical smooth surface.
  • Pre-heating 2 – 3 minutes at 130°C
  • Curing schedule 20 – 30 minutes at 130°C
  • Film Thickness 60-80 μm